E150630C |
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Manufacturer
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Manufacturer Product Number
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E150630C
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Product Description
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NON- SILICONE HEAT SINK COMPOUND |
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773 Group Part Number |
E150630C |
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Other Description
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Thermal Non-Silicone Compound
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Type
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Description
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ECCN
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EAR99
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HTSUS
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1507.90.2000
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MSL
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2 (1 Year)
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RROHS Status
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Not applicable
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Standard Packaging
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1
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| Part No. | Manufacturer | Detailed Description | RFQ |
|---|---|---|---|
| EYG-A091202M | Panasonic Electronic Components | THERM PAD 115MMX90MM W/ADH GRAY | RFQ |
| EYG-S0309ZLMF | Panasonic Electronic Components | THERM PAD 92X32MM GRAY | RFQ |
| 60-11-4511-1671 | Parker Chomerics | THERM PAD 40.46X27.94MM WHT | RFQ |
| 60-11-5791-1671 | Parker Chomerics | THERM PAD 17.45MMX14.28MM WHT | RFQ |
| 2-1963557-5 | TE Connectivity AMP Connectors | 5 FINS,2.000 OD HS W/4 LEGS,3 | RFQ |
| 6-1542003-4 | TE Connectivity AMP Connectors | 27MM LOW P HS ASSY A- | RFQ |
| 126022 | Wakefield-Vette | FLATTENED, COPPER HEATPIPE, SINT | RFQ |
| 126210 | Wakefield-Vette | FLATTENED, COPPER HEATPIPE, SINT | RFQ |
| 126402 | Wakefield-Vette | FLATTENED, COPPER HEATPIPE, SINT | RFQ |
| 126597 | Wakefield-Vette | FLATTENED, COPPER HEATPIPE, SINT | RFQ |
