XCVU19P-2FSVA3824E

Manufacturer
AMD
Manufacturer Product Number
XCVU19P-2FSVA3824E
Product Description
The XCVU19P-2FSVA3824E is a cutting-edge FPGA from Xilinx’s Virtex UltraScale+ family, designed for high-performance computing and advanced signal processing applications. This device features UltraRAM and HBM (High Bandwidth Memory) integration, offering unparalleled memory bandwidth critical for data-intensive tasks. With 16nm FinFET technology, the FPGA delivers high efficiency, exceptional logic density, and low power consumption. The package type, FSVA3824, indicates a Flip-Chip Ball Grid Array (FCBGA) with 3824 pins, ensuring robust connectivity and high-speed I/O capabilities. The "-2" speed grade signifies the device's high-performance capability, while the "E" suffix indicates extended temperature range support. This FPGA is optimized for AI acceleration, 5G communication systems, high-performance computing (HPC), and complex data centers, making it an industry-leading choice for advanced applications.
773 Group Part Number
XCVU19P-2FSVA3824E

Qty:

Product Attributes
Type
Description
ECCN
3A001A7B
Environmental Information II
-
HTSUS
8542.31.0060
MSL
4 at 72 Hours
Other Names
773-XCVU19P-2FSVA3824E - XCVU19P-2FSVA3824 - XCVU19P2FSVA3824E
Package
3824-FCBGA (65x65)
REACH
REACH is Unaffected
RROHS Status
ROHS3-Compliant
Series
Virtex® UltraScale+™

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